Lander Wang
931 Mcbride Loop San Jose. Ca. 95125
(408) 421-2369/(408) 723-0558
Landerw2007@yahoo.com ``
Objective: Mechanical engineer or designer ______________________________________________________________
Relevant skills and accomplishment
09/03-present consulting mechanical engineer
1. Working on the server writer system most likely for the automation system control and detail design as well the parts fabrication. Alignment fixture design and thermal control analysis Re the system package.
2. Accomplished the Sa unit integration project: that included miniaturization of
current package by working out optical concept layout, mechanical package
layout and package detail design and fabrication. Chassis and sheetmetal
redesign and modify to match the updated package. Alignment fixture
design and fabrication. Working out the process solution like choosing the
materials, working out the alignment plan, and final package solutions…etc.
3. Plastic injection parts design for electro-micrometers packaging boxes and performing some stress and thermal analysis Re the package that I designed.
4. In charge of automation design for the optical alignment systems that including motion simulation on the computer and figure out the control flow chart, optimizing the photo-sensor’s location to control step motor’s travel to realize the best result.
10/01-08/03 R&D mechanical engineer (AFOP Sunnyvale Ca)
1. CCWDM package design and the fabrication as well as the alignment fixture
design (like how to hold 1.2 mm dia collimator on the substrate, figured out
the methods of adjusting and mounting the tiny filter on the substrate to optimize
the optical path.
Calculated the thermal distribution and its effect on the stress distribution
while epoxy gluing & baking.
Designed the testing fixture to test the adhesive forces between the substrate and
collimators regarding the different holding methods.
2. In charge of V-mux package design and fabrication. (that nicely and neatly
integrated the 8 ch Voa, double layers of the control pcb, 16 splicer and 8 barrel
Channel dwdm as well as bench of fiber on the module of 120mm x 90mm x12.)
3. In charge splitter (PLC) package and alignment fixture design and fabrication (the
Package design has 1x4 channels, 1x8 channels, and 1x 16 channels respectively
with the materials of the aluminum as the housing.
Performed the thermal calculation on the package and the stress analysis Re the
package design.
Though combining the different optical components to apply on the alignment fixture
instead of using piezo and got the same precision results (in terms of quality
and efficiency) with almost 1/10 times cost of the computerized alignment station.
4. Performed the Fea and thermal analysis Re the AWG and Voa package and doing
some modification based on some error information feed back from the customers.
In charge of Voa package analysis (tolerance analysis, kinetics analysis as well
as dynamic analysis) and redesign.
5. In charge of Roadm concept layout design, alignment fixture design and
fabrication and. (that included the optical design layout, feasibility Study,
mechanical layout,
cost analysis, spherical lens holding, Cylindrical lens holding, grating holding,
mirror adjustment, mem’s holding and adjusting collimator’s holding and adjusting.
Package design that based on the results from the alignment testing.
Implemented some further improvement in terms of accuracy and miniturizations.
6. In charge of design Fau (Fiber array unit with different channel like 8ch,
6ch, 32ch, 40ch, 48ch…) assembly fixture and the high precision robotic
systems to make the units. (Software used pro-e & solid work)
04/98-09/01 Mechanical engineer (JDS Uniphase San Jose)
1. In charge of Opmm testing jig design and compiled the corresponding process
procedures.
2. Optical switch package design and the corresponding alignment fixture design
and in charge of transferring working stations to oversea.
3. Invented the automatic fiber-winding machine that made the fiber routing looks
neat, smooth, accurate in length and high efficiency.
4. In charge Awg packages design and fabrication, (in charge all the alignment
fixture design and fabrication like the alignment station, vibration testing fixture,
coating fixture, inspection fixture, hermetic sealing fixture, inspection fixture, chip
curing fixture, chip-polishing fixture…etc) and corresponding analysis.
Performed the thermal analysis on the chip curing process and it’s effect on the
stress distribution on the chip under some loadings.
In charge of processions injection molding part design for the package cases after
the device is finalized, and successfully brought that to the volume production.
5. Take the leading position to design and fabricate optical coupler machine
(that included the conception design and layout, precision sheet metal design
for the case and panel for the machine . material ordering and buying,
supervise the part’s fabrication, robot design and fabrication, pneumatic and
vacuum system layout design and fabrication as well as all the relevant facilities
figure out and build up…etc.)
6. Designed and modified different kind of the testing equipment and testing fixtures
for chip curing, chip polishing, chip inspections, package vibrating…ect.
7. Designed some of the sheet metal package and some testing fixtures for the
production and instrumentation (software used pro-e & solid work)
05/97-03/98 Mechanical engineer Read-Rite Milpitas Ca
1. Equipment modification and tooling design and robotic design, failure
analysis and woks out the solution as well as transferring the relevant
technologies to oversea.
2. Designed precision positioning mechanisms w/closed loop servo systems,
automatic loading and unloading mechanisms for magnetic disks.
3. Slider fab process analysis to improve the yields
02/95-05/97 Engineer (Tencor & Aio Mountain view California)
1. Concept design and lay out for the capitol equipment like wafer track
2. Coater module detail layout design and in charge of the automation portion
Design and the fabrication.
3. Pneumatic portion design for the system and the fabrication.
4. Wafer holding and transferring robotic design and fabrication.
5. Wafer heating and cleaning chamber design and fabrication.
6. System build up, failure analysis and working out the solutions.
7. System testing and optimized the different parameters.
8. Precision sheet metal design for the instruments fabrication.
08/88-08/94 Engineer (Media sciences Inc Santa Clara)
1. CD rom manufacturing (In charge of injection molding parameters optimization,
line troubleshooting, AID & CDA setting up and operation, glue dispensing control
as well as statistical analysis to improve the yields,)
2. Designed precision positioning mechanisms w/closed loop servo systems,
automatic loading and unloading mechanisms for magnetic disks.
3. Designed the hard disk manufacturing line layout and it’s facilities layout. setting
up the machineries and build up the relevant facilities and equipment.
4. Created special technology (patent) to make use of the used materials for packing
the disks.
5. Put all the key processed parameters under the statistical control, and fixed the
instability problems Re the polishing procedures,
6. Innovated the new thin film inspection methods that improved the inspection
accuracy and saved manpower to do inspection.
7. Improved the yields to 90% from 65% by optimizing and analyzing the processing
parameters
8. In charge of the incoming inspection and made the decision to take the lot or
reject based on the inspection results ( by referring U.S.A military standard
105 D). compiled all the documented Q.C monitoring procedures Re all the
steps of the hard disk production line as well as document control.
07/85-07/88 Mechanical Designer (General mechanics company)
1. Designed the hydraulic system that served the rolling steel lines (that included
choose the different type of the valves, calculated flow discharges and the volume
of the oil thanks,
2. Designed different kinds air pump and air compressors (that included discharge
calculation, thermal dynamics calculation, stroke calculation as well as
optimization between the different parameters like piston stroke, discharges,
cylinder’s size, valve’s travel, crank’s strength, heat exchanger, and cooling
circulation…etc)
3. Designed the vacuum pumps (piston pump & diffusion pumps) (that included the
conception design layout, detail dimension design, vacuum pumping rate, the
thermodynamics calculation…
station design and build up that used for measuring pumping speed, sensitivities
of the vacuum valves, air leaking, and oil return rate as well as the time to need to
reach the limit vacuum…etc.
4. Compiled some Iso document Re the design and product that listed above
that included checking the drawing format, dimension’s labeling, and some
geometrical tolerancing labeling… and compared the checking items against to
the Iso standardizations and proposed improvement suggestion back to the
designers…etc (software used Auto-cad )
Education (03/78-02/82)
North east Industrial University (Major: mechanical engineering. BSME)
References will be available upon the requirement
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